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MilitaryGoldProducts

We are committed to technological breakthroughs and strict product quality control. We provide cutting-edge plating solutions for key components like RF and microwave connectors used in aerospace and defense systems. As a domestic industry leader, we actively support national defense development.

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ProductTech

  • · Gen3SemiconductorHeatsink

    Metal/diamond composite materials represent the latest heat sink technology for third-generation semiconductor chips, with no similar products yet mass-produced on the market. Compared to domestic and international competitors, they offer significantly lower costs while improving performance by more than 1.5 times.

    · Gen3SemiconductorHeatsink

    Metal/diamond composite materials represent the latest heat sink technology for third-generation semiconductor chips, with no similar products yet mass-produced on the market. Compared to domestic and international competitors, they offer significantly lower costs while improving performance by more than 1.5 times.

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  • · GoldReflectivity

    Gold reflectivity reaches 97.5%. By adopting multilayer gold plating technology, a multilayer metal film structure can be formed on the substrate surface, improving both reflectivity and durability. This technology also allows customization of metal types and layer thicknesses to achieve optimal performance based on specific requirements.

    · GoldReflectivity

    Gold reflectivity reaches 97.5%. By adopting multilayer gold plating technology, a multilayer metal film structure can be formed on the substrate surface, improving both reflectivity and durability. This technology also allows customization of metal types and layer thicknesses to achieve optimal performance based on specific requirements.

    Contact Now

MilitaryApplications

  • Aerospace gold plating

    For aerospace and military‑grade connectors, components such as outer conductors, inner conductors, and housings are typically plated with copper, nickel, or gold, using electroplating methods like barrel plating, rack plating, and selective (spot) plating. Micro‑hole and blind‑hole parts are processed with special techniques—such as ultrasonic plating, vacuum plating, or vibratory plating. These specialized processes solve deep blind‑hole plating challenges with an aperture‑to‑depth ratio of 1:4 and enable plating of micro blind holes as small as 0.25 mm, achieving a uniform, fine, and bright finish both inside and outside the holes.

MilitaryProducts

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