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Hockwell Electroplating Process

Electroplated coatings enhance the corrosion resistance of metal parts in operational environments, improve their appearance, and boost properties such as hardness, wear resistance, conductivity, electromagnetic compatibility, heat resistance, solderability, and other specialized functions.

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ProcessIntro

A process that uses the principle of electrolysis to plate a thin layer of another metal or alloy onto the surface of certain metals. Through electrochemical reactions, metal ions in the plating solution are deposited onto the surface of the substrate metal, forming a coating layer.

  • AluminumAlloy

  • CopperParts

  • SteelParts

  • Diamond

  • TungstenCopper

  • MolybdenumCopper

  • CarbonFiber

  • Kovar

  • CopperDiamondAlloy

  • AluminumDiamondAlloy

  • CPC_CMC

SurfaceTreatment

  • NickelPlating

  • RhodiumPlating

  • GoldPlating

  • SurfacePassivation

  • CopperPlating

  • PalladiumPlating

  • AluminumPlating

  • SilverPlating

PlatingFlow

  • Dewaxing

    Dewaxing

    Removing wax ensures surface cleanliness before electroplating, thereby improving the quality and adhesion of the plating layer.

  • Dewaxing

    Dewaxing

    Removing wax ensures surface cleanliness before electroplating, thereby improving the quality and adhesion of the plating layer.

  • AcidCleaning

    AcidCleaning

    A process that employs an acid solution to remove impurities such as dirt, rust, oxides, and grease from metal surfaces, particularly steel.

  • UltrasonicCleaning

    UltrasonicCleaning

    Using tiny bubbles produced by high‑frequency ultrasonic waves to achieve deep cleaning.

  • WaterRinse

    WaterRinse

    Rinsing removes impurities from electroplated products, ensuring the purity and adhesion of the plating layer.

  • UltrasonicCleaning

    UltrasonicCleaning

    Using tiny bubbles produced by high‑frequency ultrasonic waves to achieve deep cleaning.

  • ZincDipOnce

    ZincDipOnce

    By precisely controlling the process parameters, the substrate’s reliability and durability can be ensured in a wide range of environments.

  • ZincDipTwice

    ZincDipTwice

    By precisely controlling the process parameters, the substrate’s reliability and durability can be ensured in a wide range of environments.

  • ElectroNickelPlating

    ElectroNickelPlating

    A nickel layer offers excellent corrosion resistance, effectively protecting the underlying metal from corrosion.

  • ChemicalNickel

    ChemicalNickel

    Nickel is deposited on the metal surface through an autocatalytic chemical reaction, without the need for an external electric current.

  • ImpactNickel

    ImpactNickel

    A high-density nickel layer is deposited during the electroplating process to enhance the surface hardness and wear resistance of the workpiece.

  • ElectroDegreasing

    ElectroDegreasing

    Through an electrolytic reaction, oil and contaminants on the metal surface are broken down and removed, effectively cleaning the substrate.

  • HardGoldPlating

    HardGoldPlating

    Used in electronic products such as contact points and connectors to ensure excellent conductivity and corrosion resistance.

  • SoftGoldPlating

    SoftGoldPlating

    Used in electronic products for contact points and connectors to provide excellent electrical conductivity and corrosion resistance.

ServiceScope

  • VacuumCoating

    Evaporation coating heats a material to its evaporation temperature, causing it to transition directly from solid to vapor, which then deposits on the substrate surface to form a thin film. This method can produce high‑purity, dense films and allows deposition of complex compounds and multi‑component materials. Vacuum evaporation coating technology is a common surface‑treatment technique, widely used in aerospace, electronic devices, automotive components, as well as plastic and glass products.

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  • MagnetronSputtering

    Magnetron coating places the material in a magnetic field and bombards its surface with an ion beam, ionizing the material and depositing it onto the substrate to form a thin film

    (1) Compared with low‑temperature thermal evaporation of the substrate, magnetron sputtering requires minimal heating.

    (2) It has a high deposition rate and can sputter tungsten and aluminum films as well as reactively sputter TiO₂ and ZrO₂ films.

    (3) It is an environmentally friendly process—magnetron sputtering offers high production efficiency with no environmental pollution.

    (4) The coating shows excellent firmness; the sputtered film and substrate gain improved mechanical strength and better adhesion.

    (5) The operation is easy to control: maintaining stable pressure and power during sputtering yields a consistent deposition rate.

    (6) The resulting film is uniform, with notable advantages in density and uniformity.

    (7) Metal films produced by magnetron sputtering typically achieve good optical, electrical, and other special properties.

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  • NonMetalPlating

    Ceramic metallization is a process in which a metal coating is applied to the surface of a ceramic, improving its mechanical properties, corrosion resistance, and electrical conductivity. It is widely used in electronics, aerospace, and the defense industry. 1. Principle: Ceramic metallization mainly relies on chemical reactions or physical vapor deposition and similar methods to form a uniform metal coating on the ceramic surface. 2. Process flow: The main steps are cleaning, applying the metallization coating, and heat treatment.

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